发明名称 |
Structure and process of metal interconnects |
摘要 |
A process of metal interconnects and a structure of metal interconnect produced therefrom are provided. An opening is formed in a dielectric layer. A metal layer is formed over the dielectric layer filling the opening. A film layer is formed on the metal layer and the dielectric layer. The film layer is reacted with the metal layer during a thermal process, and a protective layer is formed on the surface of the metal layer. The portion of the film layer not reacted with the metal layer is removed to avoid short between the metal layers. The protective layer can protect the surface of the metal layer from being oxidized and thus the stability and the reliability of the semiconductor device can be effectively promoted.
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申请公布号 |
US2005098892(A1) |
申请公布日期 |
2005.05.12 |
申请号 |
US20030718897 |
申请日期 |
2003.11.20 |
申请人 |
HU SHAO-CHUNG;YANG YU-RU;HUANG CHIEN-CHUNG |
发明人 |
HU SHAO-CHUNG;YANG YU-RU;HUANG CHIEN-CHUNG |
分类号 |
H01L21/4763;H01L21/768;H01L23/48;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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