METHOD FOR FORMING PHOTO-DEFINED MICRO ELECTRICAL CONTACTS

摘要

A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes (81) as one or more masks (73); a step for fabricating the plurality of probes using the mask (73); and disposing the plurality of probes (81) through corresponding holes in a first die (42) and a second die (44). The step for fabricating the plurality of probes (81) may include one of photo-etching and photo-defined electroforming.