| 摘要 |
Electrically conductive, heat-activated adhesive film based on thermoplastic polymer, tackifying resin, epoxy resin and metallised particles also contains non-deformable spacer particles which do not melt at the bonding temperature of the film. Electrically conductive, thermoplastic, heat-activated adhesive film containing (i) at least 30 wt% thermoplastic polymer, (ii) 5-50 wt% tackifying resin(s), (iii) 5-40 wt% epoxy resins with hardeners and optionally also accelerators, (iv) 0.1-40 wt% metallised particles and (v) 1-10 wt% spacer particles which are not deformable or only deformable with difficulty and which do not melt at the bonding temperature of the film. |
