LOW READ-THROUGH EPOXY-BONDED SMC

摘要

What is disclosed is a 2-part epoxy adhesive composition which comprises an epoxy compound, an optional amine hardener, optional hydroxy- substituted aromatic compound, and from 20% to 60% of the total weight of adhesive combined of liquid terminal epoxy reactive groups and amidoamine, whereby the adhesive is applied as a mixture of first and second parts in a volume ration of the first epoxy part: second cure part of 1:1.4 to 1:3.0. The adhesive is adapted to provide bonding of SMC with low or no read-through, initial and aged fiber tearing bonds and specified bond strength minimum at 400 °F (204 °C).