| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which can form a printed wiring board wherein a plurality of insulating substrates having conductor patterns on the surfaces thereof are laminated by low man hour with high precision. SOLUTION: In this manufacturing method, the printed wiring board is manufactured wherein a plurality of the insulating substrates which have the conductor patterns on the surfaces are laminated. The insulating substrates 20-22 of the shape of a B stage equipped with the conductor patterns on the surfaces are formed respectively beforehand. After that, a plurality of the respective insulating substrates 20-22 are laminated, pressurization and heating are performed, and the printed wiring board 30 is formed. COPYRIGHT: (C)2005,JPO&NCIPI |
