| 摘要 |
PROBLEM TO BE SOLVED: To provide bumps for establishing a reliable and stable connection between a semiconductor chip and its mount substrate even when the mount substrate is distorted. SOLUTION: The bumps (31a, 31b) have structure deformable under pressure upon contact with a mount substrate (10). The bumps (31a, 31b) are deformed under pressure for the establishment of electric connection between an element chip (30) and its mount substrate (10). Distortion in the mount substrate (10) is absorbed by using this design, whereby poor contact is prevented between the element chip (30) and the mount substrate (10). COPYRIGHT: (C)2005,JPO&NCIPI |
