发明名称 METHOD AND DEVICE FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a wiring board, which improve a mass productivity by shortening the tact time of a process in which a circuit pattern is formed to an insulating base material by a heating press using a stamper, while inhibiting even the progress of the crystallization of a heat-resistant thermoplastic resin constituting the insulating base material. SOLUTION: When the circuit pattern for a conductor wiring is formed on the surface of the insulating base material 16 by pressing the stamper 12 with the circuit pattern for the conductor wiring formed thereon, on the surface of the insulating base material 16 composed of a thermoplastic resin composition having a heat resistance at the glass transition temperature or higher of the thermoplastic resin composition, the stamper 12 is heated by a stamper heating apparatus 14 apart from a press device 11 pressing the stamper 12 towards the insulating base material 16. The stamper 12 after heated is moved to the press device 11, and a press operation to the insulating base material 16 is conducted in this case. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123295(A) 申请公布日期 2005.05.12
申请号 JP20030354770 申请日期 2003.10.15
申请人 MITSUBISHI PLASTICS IND LTD 发明人 SUZUKI HIDEJI;NAKAMURA YUJI;KUROSAKI NORIO
分类号 B29C43/18;B29K79/00;B29L31/34;H05K3/00;H05K3/10;H05K3/20;(IPC1-7):H05K3/10 主分类号 B29C43/18
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