发明名称 MOLD RELEASE AGENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a mold release agent capable of stably dispersing a wax in a solvent without heating the wax. SOLUTION: Almost all of a solid wax is ground into wax particles with a particle size of 5μm or below by stirring the solid wax and the solvent in a wet grinding and dispersing machine to obtain a dispersion wherein the wax particles are dispersed in the solvent. Accordingly, the wax can be dispersed in the solvent without being heated and melted by a conventional method, the labor for temperature control can be eliminated and the compounded mold release agent difficult to manufacture heretofore can be manufactured by dispersing a low boiling point solvent and a high melting point wax in a low boiling point solvent. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005119069(A) 申请公布日期 2005.05.12
申请号 JP20030354780 申请日期 2003.10.15
申请人 ESUAKOODO:KK 发明人 SUGITA SUENOBU
分类号 B22C3/00;B29C33/62;C09K3/00;C10M109/00;C10M173/00;C10M177/00;C10N20/06;C10N40/36;C10N70/00;(IPC1-7):B29C33/62 主分类号 B22C3/00
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