| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head capable of securing the printing performance even when a protecting layer is constituted by using a ceramic of a low thermal conductivity. SOLUTION: A heating part 10A of the thermal head is constituted to include a heat conduction part 7 of a high thermal conductivity which is buried in the protecting layer 6. Heat generated at a heating resistor layer 3 is conducted with priority to the heat conduction part 7, and thereafter locally conducted to a surface of the protecting layer 6 via the inside of the heat conduction part 7. Therefore, the heat is locally supplied towards a printing area of a printing medium. Unlike a conventional thermal head prone to thermal dispersion in a process wherein the heat generated at the heating resistor layer 3 is conducted to the printing area of the printing medium, the heat generated at the heating resistor layer 3 can be efficiently conducted to the printing area of the printing medium even when the protecting layer 6 is constituted by using a silicon-boron-phosphor compound (SiBP) of a low thermal conductivity. COPYRIGHT: (C)2005,JPO&NCIPI
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