Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

摘要

A semiconductor device including: a semiconductor chip; a wiring board on which the semiconductor chip is mounted; and a plurality of external terminals provided on the wiring board. The external terminals include at least one first external terminal and two or more second external terminals. The first external terminal is formed of a soldering material. Each of the second external terminals includes a soldering material and a plurality of particles formed of a resin and dispersed in the soldering material. The second external terminals are a pair of external terminals among the external terminals, and a distance between the pair of external terminals is greater than a distance between any other pair of external terminals among the external terminals.