发明名称 Low contact resistance bonding method for bipolar plates in a pem fuel cell
摘要 A separator assembly for use in a stack of electrochemical cells is provided, having a first conductive metallic substrate with a first surface and a second conductive metallic substrate with a second surface, wherein each of the first and second surfaces are overlaid with an ultra-thin electrically conductive metal coating. The first and second surfaces form electrically conductive paths at regions where the metal coating of the first and second layer contact one another. The contact of the surfaces overlaid with metal coating is sufficient to join the first and second substrates to one another. Preferred metal coatings comprise gold (Au). Methods of making such separator assemblies are also provided.
申请公布号 US2005100771(A1) 申请公布日期 2005.05.12
申请号 US20030703299 申请日期 2003.11.07
申请人 VYAS GAYATRI;BUDINSKI MICHAEL;BRADY BRIAN K.;LUKITSCH MICHAEL J.;SCHLAG HARALD 发明人 VYAS GAYATRI;BUDINSKI MICHAEL;BRADY BRIAN K.;LUKITSCH MICHAEL J.;SCHLAG HARALD
分类号 H01M8/02;H01M8/10;(IPC1-7):H01M8/10;H01M2/00;H01M2/02;H01M2/08;H01M2/14 主分类号 H01M8/02
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