| 发明名称 |
Substrate for producing a soldering connection |
| 摘要 |
A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.
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| 申请公布号 |
US2005098611(A1) |
申请公布日期 |
2005.05.12 |
| 申请号 |
US20040950185 |
申请日期 |
2004.09.24 |
| 申请人 |
REISS MARTIN;BENDER CARSTEN;NOCKE KERSTIN |
发明人 |
REISS MARTIN;BENDER CARSTEN;NOCKE KERSTIN |
| 分类号 |
B23K3/06;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K3/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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