Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

摘要

A method for producing an adhesive bond between a chip and a planar surface and the arrangement of the adhesive bond are discussed. A flexible coupling medium is applied on the planar surface or on one side of the chip over the extent of its area and, of the surfaces to be bonded to each other. The surface that is free from the coupling agent is brought into contact with the coupling agent and remains in contact under the conditions required until a stable bond is produced. The adhesive bond is characterized in that the surfaces to be bonded to each other lie at a distance opposite each other and the coupling medium spreads at least virtually over the entire surface area of one of the two sides of the chip.