发明名称 ELECTRONIC COMPONENT PACKAGING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve production efficiency by optimizing the orders of sucking and mounting components sucked by a plurality of suction nozzles. <P>SOLUTION: When electronic components are to be sucked by a plurality of suction nozzles, suction is started with the component with higher moving speed. When the respective electronic components are to be mounted on a circuit board, the mounting order is determined so that the mounting is started with the component with lower moving speed. The component with lower moving speed is one requiring mounting accuracy, and is sucked later and mounted earlier. Thus, duration time since it is sucked until being mounted is short, whereby it is less affected by the moving speed and deterioration in the mounting accuracy can be prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123487(A) 申请公布日期 2005.05.12
申请号 JP20030358628 申请日期 2003.10.20
申请人 JUKI CORP 发明人 OKUDA TADAMASA
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址