| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board whose inter-layer connection reliability is high. SOLUTION: This method for manufacturing a multilayer wiring board is characterized to adhere a connection layer having a conductor circuit, an insulating layer, a plurality of conductor posts formed on the conductor circuit through the insulating layer, and a solder layer formed on the upper face of the conductor posts so as to be projected from the insulating layer; and a connected layer having interlayer connection lands at positions opposite to the solder layer through an adhesive layer on the first stage of a heating/pressurizing device having the first stage, and the second stage wherein the solder layer is brought into contact with the connection layer, and they are placed on the second stage in a non-contact status. Then, the first and second stages are heated in a temperature exceeding such temperature that the solder layer is melted, and the second stage is brought into contact, heated and pressure-bonded, and the conductor posts and the inter-layer connection lands are solder-bonded. COPYRIGHT: (C)2005,JPO&NCIPI |
