| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiating effect of a semiconductor device whereby the heat generated by applying currents to its semiconductor elements is radiated, by reducing the area of its mounting surface. SOLUTION: The semiconductor device has a flexible board 3 so molded cylindrically as to form a heat radiating space 30 in its inside, a plurality of semiconductor elements 1 mounted on the inner surface of the flexible board 3 via inner bumps 2, and external electrodes 5 (external terminals) provided on the flexible board 3 and for connecting the wiring present on the flexible board 3 with the external wiring present on a mounting board 8. Still, a cooling means for cooling the heat radiating space 30 is provided in the space. COPYRIGHT: (C)2005,JPO&NCIPI |
