发明名称 |
RF coil design for improved film uniformity of an ion metal plasma source |
摘要 |
The present disclosure provides a system and method for providing improved film uniformity from an ion metal plasma source. The system includes a deposition chamber and a coil. The coil is comprised of a first metal and includes opposite terminal ends disposed within the deposition chamber. At least one of the opposite terminal ends of the coil is angled less than ninety degrees.
|
申请公布号 |
US2005098427(A1) |
申请公布日期 |
2005.05.12 |
申请号 |
US20030706565 |
申请日期 |
2003.11.11 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHO JUI-MU;YANG WEN-CHENG;YANG WEN-JUNG;LO Y-CHIH;HUANG TAY-LANG;HSIEH TE-HUNG |
分类号 |
C23C14/34;H01J37/32;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|