发明名称 |
Pumped liquid cooling for computer systems using liquid metal coolant |
摘要 |
Apparatus and method are provided to enable cooling electronic components in computer systems using liquid metal as a coolant. The liquid metal coolant extracts heat generated by an electronic component and flows to a heat exchanger where the heat is rejected into ambient air through force convection. A pump is used to enable the liquid metal coolant to circulate in a closed loop system.
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申请公布号 |
US2005099775(A1) |
申请公布日期 |
2005.05.12 |
申请号 |
US20030712191 |
申请日期 |
2003.11.12 |
申请人 |
POKHARNA HIMANSHU;DISTEFANO ERIC |
发明人 |
POKHARNA HIMANSHU;DISTEFANO ERIC |
分类号 |
H01L23/373;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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