发明名称 Pumped liquid cooling for computer systems using liquid metal coolant
摘要 Apparatus and method are provided to enable cooling electronic components in computer systems using liquid metal as a coolant. The liquid metal coolant extracts heat generated by an electronic component and flows to a heat exchanger where the heat is rejected into ambient air through force convection. A pump is used to enable the liquid metal coolant to circulate in a closed loop system.
申请公布号 US2005099775(A1) 申请公布日期 2005.05.12
申请号 US20030712191 申请日期 2003.11.12
申请人 POKHARNA HIMANSHU;DISTEFANO ERIC 发明人 POKHARNA HIMANSHU;DISTEFANO ERIC
分类号 H01L23/373;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/373
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