| 摘要 |
A carrier mechanism for an image sensor package, the carrier is for fixing the transparent layer of the image sensor. The carrier mechanism includes a substrate and plural positioned posts. The substrate has an upper surface, a lower surface, and plural penetrated slots through the upper surface to the lower surface of the substrate. At the periphery of the each penetrated slot of the substrate is formed with plural fixing regions, then the transparent layer is not contact with the upper surface of the substrate. The plurality of positioned post is fixed at the fixing region of the substrate to fix the periphery of the transparent layer.
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