AUTOMATED CORE PACKAGE PLACEMENT

摘要

A method of automatically placing a core package (301) in a mold (505) is provided. Locators (501) and a cavity (503) designed to receive at least a part of the core package (301) are formed in the mold (505). The mold (505) is positioned such that the locators (501) may be illuminated and one or more images are obtained of the locators (501). The images are processed to determine a target location for the core package (301) in the cavity (503), and an automated device (303) places the core package (303) in the mold (505) at the target location.