| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a semiconductor device from being relatively misaligned with a cooler in the cooling structure of the semiconductor device, wherein the semiconductor device which is equipped with a pair of heatsinks provided on both sides of a semiconductor chip and almost sealed up with resin is brought into contact with coolers via insulating materials. <P>SOLUTION: The semiconductor device 100 is equipped with the semiconductor chip 10 and the heatsinks 20 and 30 bonded on both the sides of the semiconductor chip 10, entirely sealed up with resin 60, and brought into contact with the coolers 120 through the intermediary of the insulating materials 110 in the cooling structure of the semiconductor device. In the cooling structure of the semiconductor device, a wall-shaped guide 150 for regulating a relative positional relation between the semiconductor device 100 and the cooler 120 is provided to the upper and lower surface of the semiconductor device 100, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
