| 摘要 |
A method and assembly ( 10 ) for conducting heat from a semiconductor device, such as a power flip chip ( 12 ). The assembly ( 10 ) is generally constructed to dissipate heat from the flip chip ( 12 ) when mounted to a flexible or rigid substrate ( 20 ). Heat is conducted from the flip chip ( 12 ) through upper and lower pedestals ( 26, 28 ) each of which includes a pliable pre-cured silicone adhesive pad ( 32, 36 ). The pre-cured silicon adhesive pads ( 32, 36 ) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips ( 12 ). The housing portions ( 16, 18 ) form a housing ( 14 ) when assembled, with each housing portion ( 16, 18 ) including a configured edge ( 37, 41 ) that controls the travel of the pedestals ( 26, 28 ) toward each other, to thereby limit the pressure exerted on the flip chip ( 12 ) disposed therebetween. Silicone adhesive can be applied between the edges ( 37, 41 ) to hold the housing portions ( 16, 18 ) together.
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