| 摘要 |
A first semiconductor ship is mounted on a first surface of an interposer in such a manner that a first electrode overlaps with a penetrating-hole, and a second semiconductor chip is stacked on the first semiconductor chip. A first wire is disposed on a second surface side and bonded to the first electrode and a second wiring pattern. A second wire is disposed on the first surface side and bonded to a second electrode and a first wiring pattern. A sealing section includes a first portion on the first surface, a second portion on the second surface, and a third portion linking the first and second portions through the penetrating-hole.
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