发明名称 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment
摘要 Methods are provided to form wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment, with which highly reliable electrical wirings having minute wiring patterns can be formed. In wiring forming method for a tile-shaped element, which is used, when a circuit device is formed by connecting a tile-shaped element having at least an electrode and a tile configuration to a final substrate having at least an electrode, to form an electrical wiring that electrically connects the electrode of the tile-shaped element to the electrode of the final substrate, liquid material including electro conductive material is applied to at least a part of a wiring region that is a region where the electrical wiring is formed on at least one of surfaces of the final substrate and the tile-shaped element.
申请公布号 US2005098775(A1) 申请公布日期 2005.05.12
申请号 US20040934600 申请日期 2004.09.07
申请人 SEIKO EPSON CORPORATION 发明人 KONDO TAKAYUKI
分类号 H05K3/32;H01L21/288;H01L21/60;H05K1/18;H05K3/10;(IPC1-7):H01L51/00 主分类号 H05K3/32
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