| 摘要 |
An IC transfer device is provided that can combat the generation of the cracks in handling the IC packages. When the hand 3 comes in contact with the IC package 4 accommodated on the tray 5, a load cell 6 comes in contact with a bottom surface of a base 10. Reference values as to a press-down amount and a press-down speed of the hand 3 are set in a setting section so as not to cause cracks in the IC package 4 due to the instantaneous load at the time of contact between the hand 3 and the IC package 4. In a transfer operation, when detecting the contact between the hand 3 and the IC package 4, a control section 20 controls a servomotor of the hand drive mechanism 22 so that the hand 3 operates according to the reference values set in the setting section. |
