发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent long-term storage stability, particularly, excellent plating resistance and dry etching resistance and having improved resolution and adhesion, and to provide a photosensitive dry film using the same. <P>SOLUTION: The photosensitive resin composition contains (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a constitutional unit, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group per molecule and (c) a photopolymerization initiator based on hexaarylbisimidazole compound or further contains (d) a photo-coupler at request. The photosensitive dry film uses the same. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005121790(A) 申请公布日期 2005.05.12
申请号 JP20030355032 申请日期 2003.10.15
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TANAKA YUKIHIKO;ASAHI SHINKICHI;KATSUMATA NAOYA
分类号 G03F7/004;G03F7/027;G03F7/028;G03F7/031;G03F7/033 主分类号 G03F7/004
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