| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a cover which is capable of reducing the size of a module and to provide the module using the same. SOLUTION: The cover manufacturing method comprises an insulating film forming process of forming an insulating layer 12 which is continuously extended in the lengthwise direction of a continuous metal hoop material and a pressing process of forming the cover 11 out of the hoop material making the insulating film 12 located inside after the insulating film forming process is finished. In the insulating film forming process, the insulating film 12 and blank parts 14a, 14b, and 14c where the insulating film 12 is not formed are provided in stripes, and legs 13a and 13b are provided in the banks 14a, 14b, and 14c. By this setup, a distance between an electronic part and the cover can be shortened, and the module can be reduced in size. The problem can be solved wherein a space between each electronic part and the cover can not be made small. COPYRIGHT: (C)2005,JPO&NCIPI
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