发明名称 HEAT SINK INTEGRATED RETENTION SYSTEM
摘要 A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat sink base to the circuit board component. The frame includes an actuator that has a first post and a second post. Each post has an upper end, a lower end, and a shaft portion therebetween. The lower end includes a retention lug. A cross beam interconnects the shaft portions of the posts. The frame further includes a board lock and the cam includes a lever coupled to the cam. The cam engages the actuator to move the actuator relative to the frame from a first position to a second position to lock the heat sink base to the circuit board component. The heat sink remains in the locked position when the lever is rotated from the second position to the first position.
申请公布号 US2005099780(A1) 申请公布日期 2005.05.12
申请号 US20030705592 申请日期 2003.11.10
申请人 HORNUNG CRAIG W. 发明人 HORNUNG CRAIG W.
分类号 H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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