发明名称 |
Electroless gold plating solution |
摘要 |
An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper compound, a thallium compound, and a lead compound.
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申请公布号 |
US2005098061(A1) |
申请公布日期 |
2005.05.12 |
申请号 |
US20040969604 |
申请日期 |
2004.10.20 |
申请人 |
KANTO KAGAKU KABUSHIKI KAISHA |
发明人 |
KATO MASARU;SENDA KAZUTAKA |
分类号 |
C23C16/00;C23C18/44;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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