发明名称 METHOD OF FABRICATING AN RF SUBSTRATE WITH SELECTED ELECTRICAL PROPERTIES
摘要 <p>Method for fabricating a textured dielectric substrate (400) for an RF circuit.The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206,208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.</p>
申请公布号 WO2005043681(A1) 申请公布日期 2005.05.12
申请号 WO2004US34281 申请日期 2004.10.18
申请人 HARRIS CORPORATION 发明人 TEBBE, DENNIS, L.;SMYTH, THOMAS, P.;PROVO, TERRY;RUGGIERO, DARA
分类号 C03B29/00;H01P11/00;H01Q17/00;H05K1/02;H05K1/03;H05K3/00;(IPC1-7):H01Q17/00;B32B31/10 主分类号 C03B29/00
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