| 摘要 |
A microphone module, comprising a microphone capsule (2) with an amplifier printed circuit board (4) attached thereto, is provided with a shield arrangement in the form of a half-shell, which encompasses the amplifier component elements located on one side of the printed circuit board, and which is soldered to the continuous metal lamination coating located on the opposite side of said board. The resulting shield trough surrounds the half of the metallic microphone capsule, fitted into it, while making contact thereto. The half of the rear side of the microphone capsule projecting above the printed circuit board (4) is provided with a metallized shield (14), which is in contact with the capsule housing and with the lamination coating (12) of the printed circuit board (4). The amplifier circuit on the printed circuit board is therefore completely shielded and effectively protected against interference scatter. To achieve the desired directional effect, sound pressure apertures (22) are arranged on the rear side of the microphone capsule (2), and, in order to retain and improve their effectiveness, the amplifier printed circuit board (4) is provided with corresponding cut-outs (24) on its edge on the microphone side (FIG. 1). |
