| 摘要 |
A solid-state imaging apparatus of the present invention includes a structure formed of an insulating resin and having a through-aperture, a wiring pattern formed on the surface of the structure, a solid-state image pickup element connected to the wiring pattern and fitted to the structure to cover the through-aperture, and a light transmitting member fitted to the structure to be opposite to the solid-state image pickup element and to cover the through-aperture, and which further comprises, in the light transmitting member fitting area where the light transmitting member is fitted to the structure, a through-groove that communicates with the through-aperture. |
