发明名称 |
ELECTROLYTIC COPPER PLATING SOLUTIONS |
摘要 |
Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to about 2.50 M, and which are intended for the metallization of micron-sized dimensioned trenches or vias, through-holes and microvias. |
申请公布号 |
EP1529126(A2) |
申请公布日期 |
2005.05.11 |
申请号 |
EP20030788347 |
申请日期 |
2003.08.08 |
申请人 |
ATOFINA CHEMICALS, INC. |
发明人 |
MARTYAK, NICHOLAS, MICHAEL |
分类号 |
C25D3/38;C25D7/00;C25D7/12;H01L21/288;H05K3/18;H05K3/42;(IPC1-7):C25D1/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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