| 摘要 |
A photosensitive resin composition for far-ultraviolet exposure of from 170 to 220 nm, which comprises an N-hydroxymaleinimide-type sulfonate photo acid generator having a specific structure and a resin having a substituent capable of increasing the solubility to an alkali developer by an acid, and a pattern forming method using the photosensitive resin composition. The photosensitive resin composition has a high transparency to light having a wavelength of from 170 to 220 nm and is excellent in the photocomposition property and the acid generating efficiency. |
