| 摘要 |
PROBLEM TO BE SOLVED: To stably mount balls on a warped or inclined substrate. SOLUTION: In a method of manufacturing a semiconductor device, balls are supplied to the base electrodes of a substrate, by bringing the lower surface of a ball mounting tool closer to the upper surface of the substrate by positioning the lower surface to the upper surface, after the balls are sucked to suction holes made through the lower surface of the tool and fixed to the base electrodes by temporarily melting the balls or a bonding material provided on the electrodes or applied to the surfaces of the balls. The ball mounting tool is constituted of a tool body and a flexible deformable plate provided along the lower surface of the body and the deformable plate has movable suction holes, which are formed corresponding to the base electrodes and have diameters smaller than those of the balls. At the time of supplying the balls sucked to the mobile suction holes to the substrate, the balls are released from the suction holes and gas is injected simultaneously from the suction holes, so that the balls are pressed against the substrate with the injection pressure of the gas and the deformable plate deformed by the injection pressure. |
