发明名称 Test structure of DRAM
摘要 A test structure of a DRAM array includes a substrate. A transistor is formed on the substrate and has a first region and a second region as source/drain regions thereof. A deep trench capacitor is formed adjacent to the transistor and has a first width. A shallow trench isolation is formed in a top portion of the deep trench capacitor and has a second width. The second width is substantially shorter than the first one. A third region is formed adjacent to the deep trench capacitor. A first contact is formed on the substrate and contacts with the first region. A second contact is formed on the substrate and contacts with the third region.
申请公布号 US6891216(B1) 申请公布日期 2005.05.10
申请号 US20030664163 申请日期 2003.09.17
申请人 NANYA TECHNOLOGY CORPORATION 发明人 HUANG CHIEN-CHANG;WU TIE-JIANG;HUANG CHIN-LING;TING YU-WEI;JIANG BO-CHING
分类号 H01L21/334;H01L21/8242;H01L23/544;H01L27/108;(IPC1-7):H01L31/119;H01L29/94;H01L29/76 主分类号 H01L21/334
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