Dynamic maintenance of manufacturing system components

摘要

A method and an apparatus for sorting between actual and perceived errors related to processing of semiconductor wafers. A plurality of semiconductor wafers are processed. Fault data relating to the processed semiconductor wafers is acquired. A trend associated with the fault data is determined. A determination is made whether the fault data relates to an actual fault associated with the semiconductor wafers or to a calibration error, based upon the trend. A component is notified of the calibration error in response to the determination that the fault data relates to the calibration error.