СПОСОБ ИЗГОТОВЛЕНИЯ МНОГОСЛОЙНОГО МОДУЛЯ ПЕЧАТНОЙ ПЛАТЫ С ВЫСОКОЙ ПЛОТНОСТЬЮ РАЗМЕЩЕНИЯ ЭЛЕМЕНТОВ

摘要

Production of a multi layer module for high-density printed circuits comprises anisotropically etching micro holes through a metal-coated polyimide film by immersion in an aqueous ethylenediamine/potassium hydroxide solution and removing glue from the bottom of the micro holes by spraying with solvent. Production of a multi layer module for high-density printed circuits comprises: (a) making a double-sided substrate (1) with metallized through-holes; (b) gluing the non coated side of a metal-coated polyimide film (5) to one side of the substrate with a two-state liquid epoxy glue; (c) selectively removing the metal coating from sites (9) intended for micro holes; (d) anisotropically etching micro holes through the film by immersion in an aqueous ethylenediamine/potassium hydroxide solution at a temperature of less than 25 deg C, followed by rinsing with detergent; (e) removing glue from the bottom of the micro holes by spraying with solvent so that the micro holes open onto subjacent metallized zones of the substrate; (f) metallizing the micro holes so that they are in electrical contact with the subjacent metallized zones of the substrate and with the metal coating of the film; and (g) selectively removing the metal coating to create conductors (3) in electrical contact with the micro holes.