发明名称 Semiconductor device and method of manufacturing same
摘要 A semiconductor device comprises a semiconductor substrate, and a capacitor provided above the semiconductor substrate, the capacitor comprises a lower electrode containing metal, a first dielectric film provided above the lower electrode and containing tantalum oxide or niobium oxide, a top surface of the first dielectric film including a projecting portion, an upper electrode provided above the projecting portion of the first dielectric film and containing metal, a second dielectric film provided between the lower electrode and the first dielectric film and having a lower permittivity than the first dielectric film, and a third dielectric film provided between the projecting portion of the first dielectric film and the upper electrode and having a lower permittivity than the first dielectric film.
申请公布号 US6891218(B2) 申请公布日期 2005.05.10
申请号 US20030653209 申请日期 2003.09.03
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KIYOTOSHI MASAHIRO
分类号 H01L23/52;H01L21/00;H01L21/02;H01L21/311;H01L21/3205;H01L21/3213;H01L21/768;H01L21/822;H01L21/8242;H01L23/522;H01L27/01;H01L27/04;H01L27/108;H01L29/76;H01L29/94;H01L31/119;(IPC1-7):H01L27/108 主分类号 H01L23/52
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