| 发明名称 |
A METHOD OF FABRICATING PACKAGED CONSTRUCTION, PACKAGED CONSTRUCTION, AND METAL MASK |
| 摘要 |
<p>An electronic component (1) having electrodes (2) is packaged on a printed circuit board (15) on which lands (14) are formed in a pattern of arrangement that corresponds to the electrodes (2) by soldering the electrodes (2) to the lands (14). Solder paste (11) is printed on the lands (14) in a shape such that the edges of the solder paste (11) lie inside the edges of the lands (14). The electrodes (2) are then placed on the solder paste (11), and the solder paste (11) is caused to reflow to solder the electrodes (2) to the lands (14). <IMAGE></p> |
| 申请公布号 |
KR100488222(B1) |
申请公布日期 |
2005.05.10 |
| 申请号 |
KR20020030400 |
申请日期 |
2002.05.30 |
| 申请人 |
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发明人 |
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| 分类号 |
B23K1/00;H05K3/34;B23K3/06;B23K101/42;H05K1/18;H05K3/12;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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