| 摘要 |
1,004,341. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. July 16, 1962 [July 19, 1961], No. 27231/62. Heading H1K. A glass envelope containing a semi-conductor device is sealed by placing a filling body symmetrically with reference to the opening and filling the spaces between the body and the envelope with a synthetic resin. The filling body reduces the effects of the large difference in coefficient of expansion of the glass envelope and the synthetic resin. As shown, a glass envelope 1 containing a CdS photo resistor 2 and electrode system 3, 4, 5, 7 surrounded by silicone grease 9, is sealed by placing a glass rod 10 in the opening and surrounding it with epoxy resin 11. In a larger type of photo resistor the filling body consists of two rods between which the connecting leads emerge. In the case of a shallow cup-shaped envelope the filling body may be circular with apertures for the connecting leads, or may consist of two sectors of a circle. The filling body may be made of quartz or ceramic. |
