| 发明名称 |
PAD FOR BONDING OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<p>A bonding pad in a semiconductor device can include a conductive plug pattern on a conductive layer, where the conductive layer includes a conductive material and a dummy pattern surrounded by the conductive material. Related methods are also disclosed.</p> |
| 申请公布号 |
KR20050042361(A) |
申请公布日期 |
2005.05.09 |
| 申请号 |
KR20030077189 |
申请日期 |
2003.11.01 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, YOON HAE;KWON, KI HYOUN;LEE, KYUNG TAE;LIU, SEONG HO |
| 分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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