发明名称 |
ELECTROOSMOTIC PUMPS USING POROUS FRITS FOR COOLING INTEGRATED CIRCUIT STACKS |
摘要 |
<p>A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.</p> |
申请公布号 |
WO2005041297(A1) |
申请公布日期 |
2005.05.06 |
申请号 |
WO2004US33197 |
申请日期 |
2004.10.07 |
申请人 |
INTEL CORPORATION |
发明人 |
KIM, SARAH;LIST, SCOTT, R.;MAVEETY, JAMES;MYERS, ALAN;VU, QUAT |
分类号 |
F04B17/00;F04B19/00;H01L23/473;H01L25/065;(IPC1-7):H01L23/473 |
主分类号 |
F04B17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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