发明名称 |
Mounting method of ic chip and manufacturing method of head suspension assembly with the ic chip. |
摘要 |
A method of mounting an IC chip on a suspension having connection pads. The IC chip has a circuit for a thin-film magnetic head element and connection terminals connected to the circuit. The method includes a step of increasing a load applied to the IC chip so that metal bumps formed on the connection terminals press the connection pads formed on the suspension, respectively, and a step of starting application of the ultrasonic vibration to the IC chip during the increasing of the load applied to the IC chip. |
申请公布号 |
HK1036355(A1) |
申请公布日期 |
2005.05.06 |
申请号 |
HK20010106747 |
申请日期 |
2001.09.25 |
申请人 |
TDK CORPORATION |
发明人 |
TAKAO MATSUMOTO;TAKESHI WADA;MASASHI SHIRAISHI;ATSUSHI HIROSE;MITSUYOSHI KAWAI |
分类号 |
H01L21/60;G11B5/31;G11B5/48;(IPC1-7):G11B |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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