| 发明名称 |
ADHESIVE COMPOSITIONS FOR BONDING AND FILLING LARGE ASSEMBLIES |
| 摘要 |
<p>Adhesive composition for bonding and filling large assemblies, including a mixture of 5 percent to 75 percent by weight of a thermoplastic polymer, 0.5 percent to 35 percent by weight of a polyester resin or vinyl ester resin, and 20 percent to 80 percent by weight of an alkyl acrylate or methacrylate monomer.</p> |
| 申请公布号 |
WO2005040295(A1) |
申请公布日期 |
2005.05.06 |
| 申请号 |
WO2004US32660 |
申请日期 |
2004.10.05 |
| 申请人 |
IPS CORPORATION |
发明人 |
BRIGGS, PAUL, C.;OSAE, SAMUEL, B. |
| 分类号 |
C08F263/00;C08F283/01;C08F291/00;C08L51/00;C08L55/02;C08L101/00;C09J4/06;C09J167/06;(IPC1-7):C09J4/06 |
主分类号 |
C08F263/00 |
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