发明名称 METHOD OF FABRICATING A SIGE SEMICONDUCTOR STRUCTURE
摘要 <p>A method of fabricating an integrated circuit includes providing a substrate and creating base-windows in a layer. The method also includes forming a monocrystalline SiGe base layer in each of the base layers, and polycrystalline SiGe elsewhere. Additionally, the method also includes forming a monocrystalline silicon layer over selectively exposed portions of the surface of the substrate. The integrated circuit beneficially includes silicon-based elements such as a lateral pnp transistor, a varactor, and a polysilicon transistor, which are formed on a common substrate with an npn SiGe bipolar transistor.</p>
申请公布号 WO2005041306(A1) 申请公布日期 2005.05.06
申请号 WO2004IB52184 申请日期 2004.10.24
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V.;DEIXLER, PETER;WROBLEWSKI, BRIAN;COLCLASER, ROY 发明人 DEIXLER, PETER;WROBLEWSKI, BRIAN;COLCLASER, ROY
分类号 H01L21/331;H01L21/8249;H01L29/737;(IPC1-7):H01L29/737;H01L27/06 主分类号 H01L21/331
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