METHOD OF MANUFACTURING ELECTRONIC COMPONENT

摘要

A method of manufacturing an electronic component having circuit elements (3) formed on the surface of a ceramic substrate (1) and conductive balls (2) used as electronic component terminals capable of preventing an excessive stress from being concentrated to a fixed portion between the ceramic substrate (1) and the conductive balls (2). The method comprises a first step for forming the circuit elements (3) on the surface of the large ceramic substrate (1) with division grooves (4) vertically and laterally formed in the surface thereof, a second step for dividing the substrate (1) into unit electronic component pieces (10) by providing a stress to the substrate (1) so as to spread the division grooves (4), and a third step for fixing the conductive balls (2) to the terminal parts (7) of the circuit elements (3) on the divided unit electronic component pieces (10). The first, second, and third steps are performed in this order. In this case, a step for arranging the plurality of unit electronic component pieces (10) by using a container (11) is desirably be performed before starting the third step after the second step is completed.