Method of forming a via contact structure using a dual damascene technique,申请号KR20030014122-传众专利搜索

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发明名称	Method of forming a via contact structure using a dual damascene technique
摘要
申请公布号	KR100487948(B1)	申请公布日期	2005.05.06
申请号	KR20030014122	申请日期	2003.03.06
申请人		发明人
分类号	H01L21/28;H01L21/768;(IPC1-7):H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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