发明名称 |
Composite pad assembly for electrochemical mechanical processing (ECMP) |
摘要 |
Embodiments of a pad assembly for processing a substrate is provided herein. In one embodiment, the pad assembly includes a body that has a non-conductive first surface and an opposing second surface. A conductive element has a planar first surface laterally disposed from the non-conductive first surface and defines a top processing surface therewith. An electrode is coupled to the second surface of the body. A first set of holes is formed through the body and exposes the electrode to the processing surface.
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申请公布号 |
US2005092621(A1) |
申请公布日期 |
2005.05.05 |
申请号 |
US20040980888 |
申请日期 |
2004.11.03 |
申请人 |
HU YONGQI;TSAI STAN D.;LIU FENG Q.;CHEN LIANG-YUH;WADENSWEILER RALPH;BUTTERFIELD PAUL D.;OLGADO DONALD J.;WOHLERT MARTIN;KO SEN-HOU;CHANG SHOU-SUNG |
发明人 |
HU YONGQI;TSAI STAN D.;LIU FENG Q.;CHEN LIANG-YUH;WADENSWEILER RALPH;BUTTERFIELD PAUL D.;OLGADO DONALD J.;WOHLERT MARTIN;KO SEN-HOU;CHANG SHOU-SUNG |
分类号 |
B23H5/00;(IPC1-7):B23H5/00 |
主分类号 |
B23H5/00 |
代理机构 |
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