发明名称 |
Multi-surface contact IC packaging structures and assemblies |
摘要 |
A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
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申请公布号 |
US2005093152(A1) |
申请公布日期 |
2005.05.05 |
申请号 |
US20040964578 |
申请日期 |
2004.10.12 |
申请人 |
FJELSTAD JOSEPH C.;SEGARAM PARA K.;OBENHUBER THOMAS J.;OBENHUBER INESSA;GRUNDY KEVIN P.;WIEDEMANN WILLIAM F. |
发明人 |
FJELSTAD JOSEPH C.;SEGARAM PARA K.;OBENHUBER THOMAS J.;OBENHUBER INESSA;GRUNDY KEVIN P.;WIEDEMANN WILLIAM F. |
分类号 |
H01L;H01L23/13;H01L23/31;H01L23/48;H01L23/498;H01L25/065;(IPC1-7):H01L23/48 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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